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Microvias for low cost, high density interconnects

Lau, John H & Lee, S W Ricky

Microvias for low cost, high density interconnects - McGraw - Hill, New York 2001 - xxiii,568

ISBN: 0-07-136327-0

Dewey Class. No.: 621.381046 Lau

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Microvias for low cost, high density interconnects