Lau, John H & Lee, S W Ricky <br/><br/>
Microvias  for low cost, high density interconnects 

 - McGraw - Hill, New York  2001 
 - xxiii,568 
<br/><br/><label>ISBN: </label>0-07-136327-0 
<br/><br/><label>Dewey Class. No.: </label>621.381046 Lau